As the base material of integrated circuits, silicon wafers have the characteristics of controllable resistivity and oxygen-carbon content. The single crystal ingot undergoes slicing, lapping, polishing, cleaning and other processes to obtain a silicon wafer with a specific thickness & geometric parameters and a clean surface.

With the continuous reduction of integrated circuit line width, the demand for large-size and high-quality silicon wafers is increasing. We will also keep up with the pace of the times and strive to develop and manufacture high-quality large silicon wafers for the information age The rapid development of China has contributed to the development.