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CCMC is committed to becoming one of the main suppliers of semiconductor silicon wafers in the world, breaking the long-term foreign monopoly on the domestic semiconductor silicon wafer market, and realizing the true "Chinese smart manufacturing" in the semiconductor silicon material industry.


About CCMC
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About semiconductor silicon wafers
List of Semiconductor Products
Manufacturing Methods of Semiconductor Wafers
Manufacturing Capabilities and Technical Advantages
Q&A about Silicon
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Products and Technology

The semiconductor silicon wafers of CCMC have various specifications, different material characteristics and surface treatment methods.

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From now on, describe the wonderful moments of CCMC. Every moment will become a historical milestone.

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0571-82138188
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产品与技术
Products and Technology
About Semiconductor Wafer
List of Semiconductor Products
Manufacturing Methods of Semiconductor Wafers
Manufacturing Capabilities and Technical Advantages
Q&A about Silicon
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Manufacturing Methods of Semiconductor Wafers
Single crystal ingot
After the polycrystalline silicon raw material is heated to above 1420℃ to a molten state, it is recrystallized to prepare a single crystal ingot
Single crystal ingot Single crystal ingot
Forming
The single crystal ingot is processed by slicing, beveling, lapping, and etching process to prepare silicon wafers with target geometric parameters
Forming Forming
CVD
Through the methods of DK, LTO back sealing and polycrystalline growth, the resistivity of the silicon wafer is stabilized to improve the gettering ability, thereby improving the quality of the silicon wafer
CVD CVD
Polishing
The silicon wafer through polishing and cleaning operations to obtain the finished product of the polished wafer that meets the customer's specifications, such as resistivity, geometric parameters, and particle data.
Polishing Polishing
Extension
By continuously growing a layer of monocrystalline silicon with a specific resistivity and thickness on the surface of the silicon wafer, it can meet the requirements of preparing devices.
Extension Extension
Single crystal ingot
After the polycrystalline silicon raw material is heated to above 1420℃ to a molten state, it is recrystallized to prepare a single crystal ingot
Single crystal ingot Single crystal ingot
Forming
The single crystal ingot is processed by slicing, beveling, lapping, and etching process to prepare silicon wafers with target geometric parameters
Forming Forming
CVD
Through the methods of DK, LTO back sealing and polycrystalline growth, the resistivity of the silicon wafer is stabilized to improve the gettering ability, thereby improving the quality of the silicon wafer
CVD CVD
Polishing
The silicon wafer through polishing and cleaning operations to obtain the finished product of the polished wafer that meets the customer's specifications, such as resistivity, geometric parameters, and particle data.
Polishing Polishing
Extension
By continuously growing a layer of monocrystalline silicon with a specific resistivity and thickness on the surface of the silicon wafer, it can meet the requirements of preparing devices.
Extension Extension